Semiconductor Components

ESD-safe Biodegradable Packaging for Sensitive Components

Intace BioFoam is the ideal ESD-safe biodegradable packaging solution for sensitive electronic components like semiconductors, ICs, and chips.

Electrostatic discharge (ESD) can damage these components during storage, transport, and handling. Intace BioFoam provides reliable protection while supporting sustainability goals.

Performance Features

  • Antistatic Protection: Designed to prevent electrostatic discharge and protect delicate components.

  • Shock Absorption: High shock absorption capabilities protect against mechanical shocks and vibrations.

  • Customizable Designs: Tailored to fit the specific shape and size of your semiconductor components.

Sustainability

  • Biodegradable & Home-Compostable: Our foam naturally breaks down and is compostable at home, reducing waste.

  • Environmentally Friendly: A highly sustainable alternative to plastic packaging.

Use Cases & Benefits

  • Perfect for ICs, semiconductor chips, and microchips.

  • Cost-Effective & High Performance: We offer sustainable packaging without compromising on quality or cost.

  • Helps reduce plastic waste and carbon footprints in the electronics sector.