Intace Biofoam
Bioconductive ESD Safe Electronic and Semiconductor Packaging
A New Class of Clean High Performance Packaging Materials
Intace Biofoam is the first demonstration of our polymer engineering technology, showing how natural polymers can be reprogrammed to deliver performance previously possible only with petrochemical materials. It provides stable and reliable ESD safe behavior without synthetic conductive additives, carbon fillers, or mineral based agents. Instead, the material achieves its conductive and protective properties through a proprietary molecular level processing method that unlocks new functional behavior inside natural polymers.
Intace Biofoam is designed for the needs of modern semiconductor and electronics manufacturing, where every gain in stability, conductivity, and reliability matters.
Why Semiconductor Packaging Needs a New Material Pathway
Semiconductor components are becoming smaller, more complex, and more sensitive to static charge. Traditional packaging materials rely on petrochemical foams combined with conductive fillers that add cost, weight, and environmental impact. These materials also depend on supply chains that are increasingly fragile and resource intensive.
Intace Biofoam addresses these challenges by offering conductivity, protection, and stability without the use of synthetic conductive agents. This creates a cleaner, more resilient packaging solution for advanced electronics and semiconductor components.Intace Biofoam is designed for the needs of modern semiconductor and electronics manufacturing, where every gain in stability, conductivity, and reliability matters.
1. Bioconductive Performance
Achieves stable antistatic behavior through its internal molecular structure rather than added conductive particles, fillers, or carbon agents.
2. ESD Safe Protection
Provides reliable discharge control for sensitive devices, supporting modern semiconductor handling, transport, and storage requirements.
3. Clean Material System
Made from natural polymers with no toxic additives, petrochemical fillers, or scarce minerals. The material also avoids dusting, shedding, and particle release common in composite foams.
4. High Performance Mechanical Behavior
Delivers excellent cushioning, strength, and resilience, ensuring robust protection for components during storage, shipping, and automated handling.
5. Cost Competitive
Our technology tailors conductivity and mechanical behavior through the polymer network itself, removing the need for complex additives. This approach is engineered to outperform the cost structure of conventional ESD safe foams while improving material efficiency and enabling cleaner supply chains.
6. Future Ready
Built to scale with widely available natural feedstocks and designed for compatibility with next generation semiconductor and electronic components. Provides a pathway for manufacturers to reduce dependency on plastics, avoid emerging regulatory limits, and transition toward sustainable high performance materials.
7. Sustainable by Design
Combines high performance with a radically lower environmental footprint. Created from bio based inputs, free from toxic ingredients, and aligned with the long term sustainability goals of advanced electronics manufacturers.
Key Advantages
Designed for Industry Compatibility
Intace Biofoam is being developed to align with requirements across:
Semiconductor packaging and transport
Electronic device protection
PCB and component handling
Robotics and automation systems
EV electronics and high value modules
We work closely with early partners to validate performance and ensure compatibility with existing workflows and industry standards.
We are actively refining conductivity stability, humidity tolerance, mechanical performance, and process scalability. Intace collaborates with semiconductor manufacturers, electronics producers, and advanced computing companies to accelerate validation and expand application opportunities.
If your team is building the next generation of computing or electronics systems, we welcome strategic collaboration